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- Fabrication of Through-hole Interconnect in Si Wafer for 3D Package
- Dae-Gon Kim, Jong-Woong Kim, Sang-Su Ha et al.
- J Weld Join. 2006;24(2):64-70. Published online July 18, 2006
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- Application of MEMS Technology in Microelectronic Packaging
- Jong-Woong Kim, Dae-Gon Kim, Won-Chul Moon, Jeong-Hoon Moon, Chang-Chae Shur, Seung-Boo Jung
- J Weld Join. 2006;24(2):34-41. Published online July 18, 2006
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