- Research Papers Mechanical Bonding Properties of Solderable Anisotropic Polymer Composite containing Low-Melting-Point and High-Melting-Point Solder Fillers
- Yi Hyeon Ha, Myeong Jin Jung, Jong-Moon Park, Sung Woo Choi, Jong-Min Kim, Byung-Seung Yim
- J Weld Join. 2024;42(2):149-154.
- Research Papers Conduction Path Formation Characteristics of Solderable Polymer Composite Filled with Low-Melting-Point and High-Melting-Point Alloy Fillers
- Min Jeong Ha, Ji-Ho Kim, Jae-Goo Han, Jin-Seok Yang, Jong-Min Kim, Byung-Seung Yim
- J Weld Join. 2022;40(3):242-247.
- Research Papers Influence of Carbon Nanotube Concentration on the Interconnection Properties of Solderable Isotropic and Anisotropic Conductive Adhesive
- Byung-Seung Yim, Hee Jun Youn, Jeong Il Lee, Jong-Min Kim
- J Weld Join. 2020;38(2):152-157.
- Research Papers Investigations of Material Properties of Underfill Material for Mechanical Reliability Improvement of Electronic Devices
- Byung-Seung Yim, Jin-Nam Kim, Jong-Min Kim
- J Weld Join. 2019;37(5):477-481.
- Research Papers Influence of Reductant Content within the Solderable Polymer Composite on the Coalescence and Wetting Behaviors of Low-Melting-Point Alloy Fillers
- Byung-Seung Yim, Jeong Il Lee, Jong-Min Kim
- J Weld Join. 2019;37(1):76-81.
- Research Papers Reliability Properties of Carbon Nanotube-filled Solderable Anisotropic Conductive Adhesives
- Byung-Seung Yim, Jeong Il Lee, Jong-Min Kim
- J Weld Join. 2017;35(3):15-20.
- ACF COB Bonding Process using Thermosonic
- Yong Song, Byung-Seung Yim, Jin-Sik Joung, Jong-Min Kim
- Journal of KWJS. 2011;29(1):25-28.
- Electrically Conductive Adhesive using Low-melting-point Alloy and Bonding Process using Them
- Byung-Seung Yim, Sung-Ho Jeon, Jong-Min Kim
- Journal of KWJS. 2009;27(3):23-31.