Research Papers A Study on Aging Fracture Behavior of Sintered Joint by Bi-Modal Cu Paste

Junhyuk Son, Chang-Woo Lee, Dong-Yurl Yu, Dongjin Byun, Junghwan Bang

J Weld Join. 2022;40(6):540-546.

Research Papers Terminal Sinter-Bonding Using Silver Paste for Aluminum Nitride Heater

Yun-Chan Kim, Dong-Yurl Yu, Junhyuk Son, Ji-Sung KIm, Min-Su Kim, Chang-Woo Lee, Jai-Won Byeon, Junghwan Bang

J Weld Join. 2021;39(4):384-391.

Research Papers A Study on Joint Properties of Sn-Cu-(X)Al-(Y)Si/Cu Solder by Multiple Reflow

Dong-Yurl Yu, Jun-Hyuk Son, Yong-Ho Ko, Chang-Woo Lee, Dongjin Byun, Junghwan Bang

J Weld Join. 2020;38(2):131-137.

Research Papers Intermetallic Compounds and Mechanical Property of Sn-Cu-xCr/Cu Solder Joint by Multiple reflows Conditions

Dong-Yurl Yu, Junhyuk Son, Yong-Ho Ko, Chang-Woo Lee, Junghwan Bang

J Weld Join. 2018;36(2):21-27.

Research Papers Thermal Aging Characteristics of Sn-xSb Solder for Automotive Power Module

Junhyuk Son, Minkyung Kim, Dong-Yurl Yu, Young-Ho Ko, Jeong-Won Yoon, Chang-Woo Lee, Young-Bae Park, Junghwan Bang

J Weld Join. 2017;35(5):38-47.

Research Papers Lead-free Solder for Automotive Electronics and Reliability Evaluation of Solder Joint

Jung-Hwan Bang, Dong-Yurl Yu, Young-Ho Ko, Jeong-Won Yoon, Chang-Woo Lee

J Weld Join. 2016;34(1):26-34.

Special Issues A study of joint properties of Sn-Cu-(X)Al(Si) middle-temperature solder for automotive electronics modules

Dong-Yurl Yu, Yong-Ho Ko, Junghwan Bang, Chang-Woo Lee

J Weld Join. 2015;33(3):19-24.

Technical review Joint Reliability of Sn3.5Ag, Sn0.7Cu and Sn5.0Sb Pb-free Solder and Hybrids Joining Process for Application of Automobile Electric Module

Myong-Suk Kang, Jung-Hwan Bang, Chang-Woo Lee

Journal of KWJS. 2012;30(6):1-5.

Research Papers Development of SiC Composite Solder with Low CTE as Filling Material for Molten Metal TSV Filling

Young-Ki Ko, Yong-Ho Ko, Jung-Hwan Bang, Chang-Woo Lee

J Weld Join. 2014;32(3):282-287.

Special Issues Technical Trend of TSV(Through Silicon Via) Filling for 3D Wafer Electric Packaging

Young-Ki Ko, Yong-Ho Ko, Jung-Hwan Bang, Chang-Woo Lee

J Weld Join. 2014;32(3):233-240.

Research Papers Joint Property of Sn-Cu-Cr(Ca) Middle Temperature Solder for Automotive Electronic Module

Junghwan Bang, Dong-Yurl Yu, Yong-Ho Ko, Jeonghan Kim, Chang-Woo Lee

Journal of KWJS. 2013;31(5):54-58.

Research Papers Fabrication and Reliability Test of Device Embedded Flexible Module

Dae Gon Kim, Sung Taik Hong, Deok Heung Kim, Won Sik Hong, Chang-Woo Lee

Journal of KWJS. 2013;31(3):84-88.

Special Issues Study on Joint of Micro Solder Bump for Application of Flexible Electronics

Yong-Ho Ko, Min-Su Kim, Taek-Soo Kim, Jung-Hwan Bang, Chang-Woo Lee

Journal of KWJS. 2013;31(3):4-10.

Technical reports Evaluation of Property and Reliability of Sn3.5Ag and Sn0.7Cu Pb-free Solder Joint by Complex Vibration for Application of Automobile Electric Module

Young-Ho Ko, Jung-Hwan Bang, Jeong-Han Kim, Chang-Woo Lee

Journal of KWJS. 2013;31(1):6-10.

Precise Joining Technology on Flexible Substrate by Using Micro-bumps

Min-Su Kim, Chang-Woo Lee

Journal of KWJS. 2012;30(5):1-3.

High Speed TSV Filling Technology by using Molten Solder and Fabrication of Composite Solder as Filler Material

Young-Ki Ko, Myung-Suk Kang, Sehoon Yoo, Chang-Woo Lee

Journal of KWJS. 2012;30(3):21-25.

Interfacial Microstructure and Mechanical Property of Au Stud Bump Joined by Flip Chip Bonding with Sn-3.5Ag Solder

Young-Kyu Lee, Yong-Ho Ko, Sehoon Yoo, Chang-Woo Lee

Journal of KWJS. 2011;29(6):65-70.

Optimizing Mutiple Quality Characteristics of Through Silicon Via(TSV) Interface and Solder Joint Interface by Numerical Analysis-based Taguchi Method

Han-Sur Bang, Hee-Seon Bang, Se-Min Park, Chang-Woo Lee

Journal of KWJS. 2011;29(3):35-38.

High Speed and Low Cost TSV Filling Technology by Using Molten Solder

Young-Ki Ko, Min-Kuy Han, Sehoon Yoo, Chang-Woo Lee

Journal of KWJS. 2011;29(3):14-18.

Through Silicon Via Filling and Fine Pitch Joining Technology for 3D Electronic Package

Sehoon Yoo, Chang-Woo Lee

Journal of KWJS. 2009;27(3):17-22.

Intermetallic Compounds Behavior at Laser Overlay Interface of Aluminum and Fe-based Powder

Namhyun Kang, Yeon-Gon Yoo, Chang-Woo Lee, Jeong-Han Kim

Journal of KWJS. 2007;25(3):51-56.

Necessity of Low Melting Temperature Pb-free Solder Alloy and Characteristics of Representative Alloys

Jong-Hyun Lee, Nam-Hyun Kang, Chang-Woo Lee, Jeong-Han Kim

Journal of KWJS. 2006;24(2):17-28.

[Research Papers] Development of Laser - Rotating Arc Hybrid Welding Process

Cheol-Hee Kim, Hyun-Byung Chae, Chang-Woo Lee, Jeong-Han Kim, Se-Hun Rhee

Journal of KWJS. 2006;24(1):88-92.

[Technical Report] Preliminary Study on Arc Sensor in Laser - Rotating Arc Hybrid Welding

Cheol-Hee Kim, Jun-Ki Kim, Nam-Hyun Kang, Chang-Woo Lee

Journal of KWJS. 2006;24(1):7-9.