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- So-Hee Hyun, Hye Min Lee, Mi-Song Kim, Won Sik Hong
- J Weld Join. 2023;41(5):387-395.
- Research Papers Bonding Property of Middle Temperature Sn-Ag-Cu Solder Ball Joint of Ball Grid Array Package
- Joo Young Bae, Mi-Song Kim, Hye Min Lee, Seul Gi Lee, Young-Woo Lee, Jeong Tak Moon, Won Sik Hong
- J Weld Join. 2023;41(5):379-386.
- Research Papers Solder Joint Degradation and Electrochemical Metallic Ion Migration Property of Solder Joints with Surface Finish
- Hye Min Lee, Mi-Song Kim, Won Sik Hong
- J Weld Join. 2023;41(4):265-274.