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- Joo Young Bae, Mi-Song Kim, So-Hee Hyun, Jong-Hyun Lee, Jeong Tak Moon, Young-Woo Lee, Seul Gi Lee, Hyeong-Tea Kim, Seung-Kwan Baek, Won Sik Hong
- J Weld Join. 2024;42(2):174-183.
- Research Papers Bonding Property of Middle Temperature Sn-Ag-Cu Solder Ball Joint of Ball Grid Array Package
- Joo Young Bae, Mi-Song Kim, Hye Min Lee, Seul Gi Lee, Young-Woo Lee, Jeong Tak Moon, Won Sik Hong
- J Weld Join. 2023;41(5):379-386.
- Research Papers Ultrasonic Bonding Interface Degradation Characteristics of Gold-Coated Silver Wire for Semiconductor Packaging
- Mi-Song Kim, Won Sik Hong, Sang Yeop Kim, Sung Min Jeon, Jeong Tak Moon
- J Weld Join. 2021;39(4):343-348.