- Research Papers Thermal Cycling Performance of Heterogeneous Solder Ball Joints with Sn-3.0Ag-0.5Cu and Sn-0.75Cu(-Ni,Bi) Solder Ball Composition for BGA Package
- Joo Young Bae, Mi-Song Kim, So-Hee Hyun, Jong-Hyun Lee, Jeong Tak Moon, Young-Woo Lee, Seul Gi Lee, Hyeong-Tea Kim, Seung-Kwan Baek, Won Sik Hong
- J Weld Join. 2024;42(2):174-183.
- Research Papers Bonding Property of Middle Temperature Sn-Ag-Cu Solder Ball Joint of Ball Grid Array Package
- Joo Young Bae, Mi-Song Kim, Hye Min Lee, Seul Gi Lee, Young-Woo Lee, Jeong Tak Moon, Won Sik Hong
- J Weld Join. 2023;41(5):379-386.