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Journal of KWJS. 2004;22(6):36-42. Published online January 26, 2005.
- The Thermal Fatigue Analysis and Life Evaluation of Solder Joint for Flip Chip Package using Darveaux Model
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Young-Eui Shin, Yeon-Sung Kim, Jong-Min Kim, Myun-Gi Choi
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- Abstract
- Experimental and numerical approaches on the thermal fatigue for the solder joint of flip chip package are discussed, However, it is one of the most difficult problems to choose the proper fatigue model. It was found that viscoplstie FE model with Darveaux method was very desirable and useful to predict the thermal fatigue life of solder joint for flip chip package under 208~423K thermal cycling condition such as steep slope of temperature(JEDEC standard condition C), Thermal fatigue life was 1075 cycles as a result of viscoplatie model. It was a good agreement compared to the experimental. And also, it was found from the experimental that probability of the thermal fatigue life was 60% at 1500 cycles.
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