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2032326
Mechanical Bonding Properties of Solderable Anisotropic Polymer Composite containing Low-Melting-Point and High-Melting-Point Solder Fillers
Yi Hyeon Ha, Myeong Jin Jung, Jong-Moon Park, Sung Woo Choi, Jong-Min Kim, Byung-Seung Yim
J Weld Join. 2024;42(2):149-154.   Published online April 30, 2024
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2032320
Research Trends in the Directed Energy Deposition Method of Heterogeneous Materials
Raj Narayan Hajra, Jeoung Han Kim
J Weld Join. 2024;42(1):88-98.   Published online February 28, 2024
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2032319
Assessment of Ttensile-Shear and T-Peel Strengths for Cu-STS 304 Dissimilar Overlap Welded Joints using Single-Mode Fiber Laser with High Welding Speeds
Youngjin Eun, Sanghoon Kang, Minjung Kang
J Weld Join. 2024;42(1):81-87.   Published online February 28, 2024
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2032314
A Study on the Residual Stress of Seam Pipe Cutting and Girth Welding
Ji-Sun Roh, Myung-Su Yi, Jung-Goo Park, Myung-Hyun Kim
J Weld Join. 2024;42(1):27-40.   Published online February 28, 2024
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Investigation on the Microstructure Evolution and Mechanical Properties of High Carbon Steel Friction Welded Joint
Kyoung-Hwan Kim, Bongjun Kim, Joonoh Moon, Jungwon Lee, Yonghyun Kim
J Weld Join. 2023;41(6):566-572.   Published online December 31, 2023
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Bonding Characteristics of Solder and Sinter Joints on Active-Metal-Brazing Substrates with Nano Sputtered Ag-Cu-Ti Brazing Filler Metal
Mi-Song Kim, Won Sik Hong, Yong-Mo Kim
J Weld Join. 2023;41(6):558-565.   Published online December 31, 2023
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Electrochemical Metallic Ion Migration Property of Multi-Layer Ceramic Capacitor for Car Electronics
Won Sik Hong, Mi-Song Kim, Joo Young Bae et al.
J Weld Join. 2023;41(6):519-527.   Published online December 31, 2023
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Comparative Analysis of SPR and SPR-Bonded Joints of Hot Press Forming Steel and AA5052 under Corrosive Conditions
Han-ju Lee, Savyasachi Nellikode, Tae-Young Kang, Yeong-Do Park
J Weld Join. 2023;41(6):486-499.   Published online December 31, 2023
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2032294
Bonding Property of Flip-Chip Chip-Scale Package with Vacuum Reflow and Thermal Compression Bonding Processes
So-Hee Hyun, Hye Min Lee, Mi-Song Kim, Won Sik Hong
J Weld Join. 2023;41(5):387-395.   Published online October 31, 2023
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2032293
Bonding Property of Middle Temperature Sn-Ag-Cu Solder Ball Joint of Ball Grid Array Package
Joo Young Bae, Mi-Song Kim, Hye Min Lee et al.
J Weld Join. 2023;41(5):379-386.   Published online October 31, 2023
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2032288
A Study on Gap Bridging Formation Conditions in Butt Root Pass Welding Using GTAW
Daekyu Park, Changsub Song, Youngwhan Park
J Weld Join. 2023;41(5):335-341.   Published online October 31, 2023
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2032284
Interfacial Properties of Sn-Cu-xCr Alloy using Laser-Assisted Bonding
Shin-Il Kim, Dong-Yurl Yu, Yun-Chan Kim, Junhyuk Son, Dongjin Byun, Junghwan Bang
J Weld Join. 2023;41(4):291-298.   Published online August 31, 2023
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2032281
Solder Joint Degradation and Electrochemical Metallic Ion Migration Property of Solder Joints with Surface Finish
Hye Min Lee, Mi-Song Kim, Won Sik Hong
J Weld Join. 2023;41(4):265-274.   Published online August 31, 2023
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2032278
An Experimental Study on Welding Distortion in High-Density Polyethylene (HDPE) Welded Structures
Suji Kang, Jaemin Lee
J Weld Join. 2023;41(4):238-243.   Published online August 31, 2023
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2032274
A Study on the Change of Wire Feeding Speed in GTA Welding (Ⅱ) - Development of Weld Bead Shape Prediction Model -
Daekyu Park, Changik Lee, Youngwhan Park
J Weld Join. 2023;41(3):207-212.   Published online June 30, 2023
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